Patent · US Active

Integrated circuit interconnects

US11018054B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Daniel J. Zierath · Portland, US
Flavio Griggio · Portland, US
John D. Brooks · Hillsboro, US

Key dates

Filing date	Apr 12, 2017
Grant date	May 25, 2021
Priority date	—
Expiry date	Apr 12, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76885
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein are integrated circuit (IC) interconnects, as well as related devices and methods. For example, in some embodiments, an interconnect may include a first material and a second material distributed in the first material. A concentration of the second material may be greater proximate to the top surface than proximate to the bottom surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.