Reduction of surface recombination losses in micro-LEDs
US11018280B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2020 |
| Grant date | May 25, 2021 |
| Priority date | — |
| Expiry date | Feb 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8242
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed herein are systems and methods for reducing surface recombination losses in micro-LEDs. In some embodiments, a method includes increasing a bandgap in an outer region of a semiconductor layer by implanting ions in the outer region of the semiconductor layer and subsequently annealing the outer region of the semiconductor layer to intermix the ions with atoms within the outer region of the semiconductor layer. The semiconductor layer includes an active light emitting layer. A light outcoupling surface of the semiconductor layer has a diameter of less than 10 μm. The outer region of the semiconductor layer extends from an outer surface of the semiconductor layer to a central region of the semiconductor layer that is shaded by a mask during the implanting of the ions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.