Patent · US Active

Reduction of surface recombination losses in micro-LEDs

US11018280B2 · kind B2 · utility

2Cited by
13References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 25, 2020
Grant dateMay 25, 2021
Priority date
Expiry dateFeb 25, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/8242
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Disclosed herein are systems and methods for reducing surface recombination losses in micro-LEDs. In some embodiments, a method includes increasing a bandgap in an outer region of a semiconductor layer by implanting ions in the outer region of the semiconductor layer and subsequently annealing the outer region of the semiconductor layer to intermix the ions with atoms within the outer region of the semiconductor layer. The semiconductor layer includes an active light emitting layer. A light outcoupling surface of the semiconductor layer has a diameter of less than 10 μm. The outer region of the semiconductor layer extends from an outer surface of the semiconductor layer to a central region of the semiconductor layer that is shaded by a mask during the implanting of the ions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.