Patent · US Active

Radio frequency shielding within a semiconductor package

US11018713B2 · kind B2 · utility

1Cited by

1References

18Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

Edmund Goetz · Dachau, DE
Bernd Memmler · Riemerling, DE
Jan-Erik Mueller · Ismaning, DE
Peter Baumgartner · Munich, DE

Key dates

Filing date	Oct 17, 2018
Grant date	May 25, 2021
Priority date	—
Expiry date	Oct 17, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.