Integrated thermal management system
US11021041B2 · kind B2 · utility
5Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2019 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Aug 19, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/70
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
An integrated thermal management system includes a cooling circuit having a component thermal conditioning circuit, a battery thermal conditioning circuit, a cabin heating circuit, a cabin cooling circuit and a valve group configured for selectively interconnecting or isolating the component thermal conditioning circuit, the battery thermal conditioning circuit, the cabin heating circuit and the cabin cooling circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.