Dual cure monomers
US11021574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2017 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Nov 21, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/22
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are dual cure monomer are of the formula: (I) wherein R* is a (hetero)hydrocarbyl group; X1 is —O—, —S—, —NR3—, —NR3—CO—NR3, —CO—NR3— or NR3—CO—, where R3 is H, C1-C4 alkyl or R1-Epoxy; R1 is a divalent (hetero)hydrocarbyl group; X2 is —O—, —S—, —NR4—, —NR4—CO—NR4—, —CO—NR4—, —NR4—CO— where R4 is H, C1-C4 alkyl or R2—CH═CH2; R2 is a divalent (hetero)hydrocarbyl group; subscripts a and b are at least one, subscripts c and d are at least one, with the proviso that the monomer has at least two epoxy groups and at least two ene groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.