Plating solution and metal composite and method of manufacturing the same
US11021804B2 · kind B2 · utility
0Cited by
13References
6Claims
0Family size
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Key dates
| Filing date | Oct 31, 2018 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Nov 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.