CTE-matched heat pipe
US11022379B2 · kind B2 · utility
0Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2019 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | May 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.