Pattern projection depth value 3D scanning device and method
US11022435B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 5, 2017 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Apr 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2201/0452
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are a 3D scanning apparatus and a 3D scanning method. The 3D scanning apparatus includes a projector projecting patterns previously set onto a subject that is to be 3D scanned, a photographing unit photographing each of the patterns projected onto the subject at each of exposure levels previously set, a calculating unit calculating a depth value for each pixel of the subject based on the patterns photographed at each of the exposure levels, and a scanning unit 3D scanning the subject, which is photographed, based on the calculated depth value. The calculating unit calculates the depth value for each pixel of the subject by calculating the depth value for each pixel of the subject at each of the exposure levels and combining the depth values for the pixel, which are calculated at each of the exposure levels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.