Electronic component including sensor device and method of manufacturing same
US11022590B2 · kind B2 · utility
0Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2017 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Sep 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electronic component comprises a carrier (3), a sensor device (2) mounted on the carrier (3), which sensor device (2) comprises a sensor chip (21), and an electrostatic discharge protection element (1) for protecting the sensor chip (21) from an electrostatic discharge, which protection element (1) is mounted on the carrier (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.