Panel with multiple conductive patterns
US11023061B2 · kind B2 · utility
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13Claims
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Key dates
| Filing date | Aug 13, 2019 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Dec 31, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04111
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A panel is provided, including a first conductive pattern and a second conductive pattern. The first conductive pattern includes a first portion and a second portion; the second conductive pattern connects the first portion to the second portion, and an insulation pattern substantially covering a side surface of the second conductive pattern. The insulation pattern is formed by thermally treating a mask pattern of an insulation material. A horizontal distance between an outer side surface of the insulation pattern and an inner side surface adjacent to the second conductive pattern is less than 3 micrometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.