Hermetically sealed surface mount polymer capacitor
US11024464B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2018 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Oct 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G9/26
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A hermetically sealed polymer capacitor and a method of forming the same are disclosed. The method preferably includes dispensing an amount of conductive paste inside a case and inserting one or more capacitor elements into the conductive paste. The conductive paste may surround sides of the one or more capacitor elements. Optionally, a bushing may be placed on the one or more capacitor elements. The bushing may have one or more holes that allow one or more positive leads coupled to the one or more capacitor elements to pass through. A cover is preferably welded to the opening of the case. The capacitor assembly is preferably dried to evacuate moisture from inside the case. The one or more positive leads are preferably welded to one or more metal tubes of a glass to metal seal (GTMS) in the cover to seal the capacitor assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.