Semiconductor device and method of manufacturing the same
US11024566B2 · kind B2 · utility
0Cited by
1References
6Claims
0Family size
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Key dates
| Filing date | Oct 15, 2019 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Oct 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A first semiconductor chip and a second semiconductor chip are stacked such that a first inductor and a second inductor face each other. An insulating sheet is disposed between the first semiconductor chip and the second semiconductor chip. The sealing member seals the first semiconductor chip, the second semiconductor chip, and the insulating sheet. The sealing member is disposed both between the insulating sheet and the first semiconductor chip and between the insulating sheet and the second semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.