Image sensor and method of fabricating the same
US11024659B2 · kind B2 · utility
1Cited by
7References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 29, 2019 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Aug 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8037
Abstract
An image sensor and a method of fabricating an image sensor are provided, the image sensor including a plurality of color filters spaced apart from each other on a semiconductor substrate; a protective layer covering sidewalls of the color filters and top surfaces of the color filters; and a low-refractive pattern filling a space between the color filters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.