Patent · US Active

Method for producing electronics housings

US11026339B2 · kind B2 · utility

0Cited by

5References

18Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Klaus Eppel · Achern, DE
Michael Schermann · Freising, DE
Reiner Ramsayer · Rutesheim, DE
Wolfgang Glueck · Baden-Baden, DE

Key dates

Filing date	Oct 20, 2015
Grant date	Jun 1, 2021
Priority date	—
Expiry date	Jan 18, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2101/36
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for producing a housing for electronics in which the housing is formed by a first housing element and a second housing element and in which the housing elements are composed of aluminum or an aluminum alloy. The method further includes connecting the housing elements to one another by welding so that the housing elements are held tightly together. The method also includes producing at least one of the housing elements by a die casting method in which gas that is created in the die-casting method is evacuated from the housing element by helium gas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.