Electronic device
US11026348B2 · kind B2 · utility
0Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2019 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Oct 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0049
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Provided is an electronic device including a metal plate that is exposed on at least one of a plurality of side surfaces of the electronic device so as to absorb heat from a heat generating component that generates heat inside the electronic device and guide the heat to an outside of the electronic device. In addition, an outer surface of the metal plate exposed to the outside is formed further inside the electronic device than a first member and a second member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.