Telecommunications enclosure with separate heat sink assembly
US11026349B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2018 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | May 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a telecommunications enclosure. The telecommunications enclosure includes a housing defining an interior and including at least one cable port. The telecommunications enclosure also includes a printed circuit board in the interior of the housing and heat generating components on the printed circuit board. The telecommunications enclosure further includes a heat sink assembly in the interior of the housing. The heat sink assembly includes a thermally conductive plate mounted to transfer heat to the housing; and heat sink components extending from a first face of the thermally conductive plate. Each heat sink component corresponds to and is in alignment with one of the heat generating components. The heat sink assembly is a separate component from the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.