Molding resin to form continuous structures
US11027463B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2018 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Sep 4, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/729
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding apparatus includes a movable molding surface with molding cavities, a pressure shoe with a stationary outer surface that defines in cooperation with the molding surface a pressure zone, and a resin source configured to introduce molten resin into the pressure zone to be forced into the molding cavities by pressure in the pressure zone. The molding surface is movable with respect to the pressure shoe to introduce molding cavities to the pressure zone to be filled with resin while the outer surface of the pressure shoe and the molding surface define in between an entrance gap of decreasing width upstream of the pressure zone. The outer surface of the pressure shoe is spaced from the molding surface in the pressure zone to define a minimum gap at which the outer surface of the pressure shoe has a slope parallel to the molding surface. The pressure shoe is adapted to be held in a flexed condition against resin in the pressure zone while forcing resin into the cavities, with the outer surface of the pressure shoe curved upstream of the pressure zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.