Relating to structural adhesives
US11028220B2 · kind B2 · utility
0Cited by
201References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2015 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Oct 7, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2463/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention relates to structural adhesives and in particular to structural adhesives which are heat activated and which can be used for the bonding of components, particularly metal components, employed in the automotive industry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.