Heat resistant polyimide film and preparation method thereof
US11028226B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Nov 2, 2017 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Aug 21, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/003
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive—polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.