Resin composition, film, infrared cut filter, method of manufacturing infrared cut filter, solid image pickup element, infrared sensor, and camera module
US11028251B2 · kind B2 · utility
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1References
29Claims
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Key dates
| Filing date | Aug 22, 2019 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Sep 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/12
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a resin composition including: an infrared absorbing pigment; and a resin having an infrared absorbing group. In addition, provided are a film that is formed using the resin composition, an infrared cut filter, a method of manufacturing an infrared cut filter, a solid image pickup element, an infrared sensor, and a camera module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.