Dual cure adhesive composition and methods for its preparation and use
US11028297B2 · kind B2 · utility
0Cited by
22References
14Claims
0Family size
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Key dates
| Filing date | Aug 21, 2018 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Aug 21, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/57
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.