Booting a system-on-chip
US11029964B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2019 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Dec 27, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F8/63
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Approaches for configuring a system-on-chip (SOC) include generating component images for components of the SOC. A first component image is for a platform management controller, a second component image is for programmable logic, and a third component image is for a processor subsystem. The plurality of component images are assembled into a programmable device image, and the programmable device image is input to the platform management controller. The platform management controller is booted from the first component image, the programmable logic is configured with the second component image by the platform management controller in executing the first component image, and the processor subsystem is configured with the third component image by the platform management controller in executing the first component image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.