Interface device and interface method for 3D semiconductor device
US11031923B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Sep 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K3/35625
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An interface device and an interface method for interfacing between a master device and a slave device is provided. The master device generates command and the slave device generates data according to the command. The interface device includes a master interface and a slave interface. The master interface is coupled to the master device and configured to send the command to the slave device and/or receive the data from the slave device. The slave interface is coupled to the slave device and configured to receive the command from the master device and/or send the data to the master device. The master interface and the slave interface are driven by a clock generated by a clock generator. The master interface and the slave interface are electrically connected by one or plurality of bonds and/or TSVs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.