Terminal assembly structure of MEMS microphone
US11032652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2019 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Jul 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A terminal assembly structure of a MEMS microphone, including a signal let out board disposed at a terminal and a silicon microphone disposed at the signal let out board. The silicon microphone includes a housing, a substrate forming an accommodation space with the housing, and an MEMS chip accommodated in the accommodation space. A position of the substrate corresponding to the MEMS chip is disposed with a sound inlet connected to the outside, wherein a position where the signal let out board corresponding to the silicon microphone is disposed with an accommodation hole. The housing is accommodated in the accommodation hole. The substrate abuts a surface of the signal let out board and covers the accommodation hole. A surface of the substrate disposed with the housing is provided with a pad which is electrically connected with the signal let out board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.