Electronic system comprising an electronic module
US11032951B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2018 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | Nov 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/473
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a three-dimensional electronic module comprising an electronic device housed between a first substrate and a second substrate, said first and second substrates being electrically and/or thermally connected to one another by at least one and preferably two heat bridges added onto and rigidly connected to said first and second substrates. The invention also relates to an electronic system comprising at least two electronic modules mounted facing one another so as to sandwich a third substrate in contact with the second substrate thereof, respectively. The third substrate is configured to provide thermal and electrical coupling between the two electronic modules via the second substrate (140) thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.