Wireless sensor for measuring pressure
US11033192B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2018 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Oct 1, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A pressure sensor is provided that comprises an upper wafer formed from a dielectric material, the upper wafer having channels. The upper wafer includes a first capacitor plate and a second capacitor plate formed on a lower surface of the upper wafer. An inductor is contained within the channels in the upper wafer in fixed relation to the first and second capacitor plates. A lower wafer is formed from the dielectric material. A third capacitor plate is formed on an inner surface of the lower wafer. The upper and lower wafers are fused together to form a monolithic housing such that the first and second capacitor plates are arranged in parallel, spaced-apart relation from the third capacitor plate. The lower wafer comprising a pressure sensitive deflective region underlying the third capacitor plate. The deflective region deflects in response to changes in ambient pressure in the medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.