Thermal conditioning assembly
US11035622B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2020 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Jun 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20336
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal conditioning assembly includes a casing having a first casing portion, a second casing portion and a partition intermediate the casing portions, peripheries of each of the casing portions and the partition united so as to delimit hermetically sealed first and second casing chambers. The first chamber is characterized by the first casing portion and a first surface of the partition and includes a phase change media and wicking structure, heat spreading from a heat source adjacent thereto thusly effectuated. The second chamber, characterized by the second casing portion and a second surface of the partition, dissipates heat from the first chamber. Segments of the second casing portion and the partition are selectively united so as to form one or more baffles which delimit coolant channels. The second chamber includes first and second coolant connectors for coolant ingress and egress in furtherance of circulating coolant through the second chamber via said coolant channels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.