Device and method for thermal stabilization of probe elements using a heat conducting wafer
US11035898B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2020 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | May 11, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermally conductive material, device, and method for predictably maintaining the temperature state and condition of the contact elements and support hardware of a tester interface, such as a probe card, for a testing apparatus, such as automated test equipment (ATE), that has a predetermined configuration applicable for the particular pin contact elements, thermal conditions. The thermally conductive device also has a substrate having a predefined form factor which can be readily introduced into the testing apparatus during normal testing operations. Unlike a patterned substrate that is constrained to specific probe element layouts, the unpatterned surface of the heat conductive device facilitates use with multiple probe card designs within numerous automated test equipment (ATE) tools.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.