Multi-lenslet PIC imagers and packaging configurations
US11035985B1 · kind B1 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2019 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | May 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/69
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dual-lenslet array photonic integrated circuit (PIC) imager includes a PIC and top and bottom substrate spacers. A first optical prism couples a first lenslet array to a first-side edge of the PIC. A second optical prism couples a second lenslet array to a second-side edge of the PIC. Lenslets of the first lenslet array and respective lenslets of the second lenslet array are coupled to respective waveguides embedded in the in the PIC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.