Heat dissipation module and projection apparatus
US11036118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2019 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Nov 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N9/3114
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation module and a projection apparatus are provided. The heat dissipation module dissipates the heat generated by a plurality of heating elements, includes a heat pipe, a heat dissipation plate, a first and a second heat dissipation fins. The heat pipe includes a first portion of the heat pipe passes through the first heat dissipation fin and a second portion of the heat pipe passes through the second heat dissipation fin and a third portion connected with the first and the second portions. The third portion of the heat pipe and the heating elements are connected to the heat dissipation plate. The heat generated by the heating elements is dissipated by the heat dissipation plate, the first and the second heat dissipation fins through thermal conduction method and thermal convection method. The invention saves accommodating space in the projection apparatus and has an efficient heat dissipation effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.