Patent · US Active

Method and apparatus for simulating flexible panel

US11036901B2 · kind B2 · utility

0Cited by

0References

11Claims

0Family size

Assignee

BOE Technology Group Co., Ltd. · CN

Inventors

Xixi Guo · Beijing, CN
Shang Chieh Chu · Baoshan, TW
Shiming Shi · Beijing, CN

Key dates

Filing date	May 22, 2018
Grant date	Jun 15, 2021
Priority date	—
Expiry date	Nov 12, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/0005
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

The embodiments of the present disclosure provide a method and apparatus for simulating a flexible panel. The method comprises: establishing a geometric model of the flexible panel; cutting a layer adjacent to a layer where a wiring region is located in the geometric model of the flexible panel; partitioning the following regions or layers in the cut geometric model into grid cells: the wiring region, layers other than the layer where the wiring region located and the layer adjacent to the layer where the wiring region is located, and regions obtained by cutting the layer adjacent to the layer where the wiring region is located; and simulating the flexible panel based on the partition.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.