Apparatus and method for manufacturing assembly having multiple separated conductors embedded within a substrate
US11037706B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2018 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Jul 20, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus includes an electronic controller having a memory device and an extruding device connected to the electronic controller. The extruding device has a dispensing head configured to dispense a dielectric material though an orifice in the dispensing head as commanded by the electronic controller. A wire feed device is connected to the electronic controller and the extruding device and is configured to feed a conductive wire through the orifice as commanded by the electronic controller. A cutting device is connected to the electronic controller and the extruding device. The cutting device severs the wire after it is fed through the orifice as commanded by the electronic controller. An electromechanical device is connected to the electronic controller and to the extruding device. The electromechanical device is configured to move the extruding device, the wire feed device, and the cutting device within a 3D space as commanded by the electronic controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.