Semiconductor module
US11037867B2 · kind B2 · utility
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14Claims
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Assignee
Inventor
Key dates
| Filing date | Apr 25, 2018 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Apr 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73263
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module has at least two semiconductor components which are arranged within a housing in each case between two electrical conduction elements and are electrically conductively connected to the electrical conduction elements. The electrical conduction elements respectively have a contact extension that is led out of the housing, wherein two contact extensions arranged in different planes are connected to one another outside the housing via a contact element, which forms a current path between the two contact extensions outside the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.