Method of producing an optoelectronic component

US11038090B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Daniel Leisen · Regensburg, DE
• Herbert Brunner · Sinzing, DE
• Emilia Dinu · Regensburg, DE
• Jens Eberhard · Lemgo, DE
• Christina Keith · Neutraubling, DE
• Markus Pindl · Tegernheim, DE
• Thomas Reeswinkel · Regensburg, DE
• Daniel Richter · Bad Abbach, DE
• Christopher Wiesmann · Barbing, DE
• Ludwig Peyker · Regensburg, DE
• Alexander Linkov · Regensburg, DE

Key dates

• Filing date: Jul 31, 2018
• Grant date: Jun 15, 2021
• Expiry date: Aug 25, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/882

Abstract

A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.