Manufacturing method for flexible printed circuit board
US11039539B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 25, 2019 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Dec 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method for flexible printed circuit board is provided, in which a flexible insulating material and a metal material are liquefied and the liquefied materials are coated and solidified to form a flexible insulating layer and an anti-EMI layer of an anti-EMI structure, respectively. As such, an adhesive layer can be eliminated and the thickness of the flexible insulating layer and the anti-EMI layer can be reduced and an amount of materials consumed is also reduced, resulting in reduction of production cost, reduction of thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.