Method for forming and detecting security elements on the surface of a component or in a component, and system for detecting said security element
US11040564B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 26, 2017 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Apr 26, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V20/95
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for forming and detecting security elements on the surface of a component and/or in a component, in which at least one layer or at least one region that is preferably formed of a magnetic material or of a material different from the component material is formed on the surface of the component and/or in the component that is formed of a magnetic or of a nonmagnetic material in a locally and geometrically defined manner. At least one ablated track, at least one heat-affected region and/or at least one remelted treatment track are/is formed by a locally and geometrically defined ablation of material or input of energy on/at the surface of a component along a predefined contour corresponding to the respective security feature. In the manufacture of the component, a magnetic material different from the material of the component is introduced into the component at at least one predefined position in a locally and geometrically defined manner by way of a generative production process. To detect the security element, a magnetization unit is used to generate at least one magnetic field penetrating into the component or a magnetic flux is produced inside the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.