Conductive thermoplastic polyamide molding compound
US11041047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2017 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Aug 26, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/004
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a polyamide moulding compound consisting of the following components: (A) 35-68 wt. % of at least one semi-crystalline, semi-aromatic, thermoplastic polyamide based on aliphatic diamines with 4-8 carbon atoms with a melting temperature of at least 270° C.; (B) 15-22 wt. % carbon fibres; (C) 18-30 wt. % glass fibres; (D) 1-10 wt. % of an impact-resistance modifier that is different from (E) and/or polymers that are different from (A), (E) and (F); (E) 0-10 wt. % ethylene-vinyl acetate copolymer; and (F) 0-3 wt. % additives. In this way, the sum of the components (A)-(F) is 100 wt. %, the sum of the components (B)-(C) is in the range of 33-48 wt. %, and the sum of the components (D)-(E) is in the range of 2-12 wt. %. The moulding compound permits the production of dimensionally stable, electrically conductive components, e.g. for the automotive sector and for contact with fuels, in particular methanol-containing petrol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.