Patent · US Active

Palladium-based alloys

US11041228B2 · kind B2 · utility

0Cited by
7References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 11, 2019
Grant dateJun 22, 2021
Priority date
Expiry dateJul 11, 2039

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R1/06755
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Palladium-based ternary or higher alloys include palladium at about 45-55 wt %, copper about 32-42 wt %, silver at about 8-15 wt %, rhenium at about 0-5 wt %, and optionally one or more modifying elements at up to 1.0 wt %. The alloys are age-hardenable, provide hardness in excess of 350 HK (Knoop, 100 g load), have electrical conductivities above 19.5% IACS (International Annealed Copper Standard), have an elevated temperature strength above 100 ksi at temperatures up to 480° F. (250° C.), and remain ductile (tensile elongation>2%) in their fully age-hardened condition. The alloys may be used in static and moveable electrical contact and probe applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.