Bonded assembly with integrated temperature sensing in bond layer
US11041766B2 · kind B2 · utility
0Cited by
7References
20Claims
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Key dates
| Filing date | Jul 7, 2015 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Jul 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly, for example an electrostatic chuck, is provided including a substrate, an electrostatic chuck, a heating plate, and a bond layer comprising a phosphorescent material. In one form, an optical sensor is disposed proximate the bond layer to detect a temperature of the bond layer in the field of view of the optical sensor. The phosphorescent material is illuminated and the subsequent decay is observed by the optical sensor. From this information, the temperature of the electrostatic chuck and substrate is determined and heating elements may be adjusted by a controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.