Sensing device of pressure and temperature in mold
US11041767B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2019 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Jan 29, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L23/22
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensing device of pressure and temperature in a mold comprises: a housing communicating with a mold cavity, and including a channel and an accommodating space; a base on a bottom surface of the housing, and including a mesa on a top; a strut in the accommodating space, and a front end thereof extended into the channel and exposed to the mold cavity; a strain structure between the mesa and a back end of the strut, and located on the mesa; a strain gage on the strain structure to measure a deformation amount of the strain structure the mold cavity and transforming the deformation amount into deformation amount information; a temperature-sensing element in the strut to measure a temperature of the strut, and transforming the temperature into strut temperature information; and a processing unit to obtain the deformation amount information and the strut temperature information.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.