Chip on film package and display device including the same
US11043438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2018 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Feb 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chip on film package includes a driving integrated circuit chip; a base substrate including: a driving integrated circuit region, and a first region at which stress is converged by the base substrate bent along a side surface of the display panel; and an electrical ground pattern structure on the base substrate in the first region thereof at which the stress is converged. The electrical ground pattern structure is connected to a first side of the driving integrated circuit chip, and the ground pattern structure includes extended from the first side of the driving integrated circuit chip: in a first portion of the first region, ground patterns each inclined in a first direction, and in a second portion of the first region, ground patterns each inclined in a second direction different from the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.