Method of manufacturing a HEMT device with reduced gate leakage current, and HEMT device
US11043574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2019 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Aug 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/256
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An HEMT device of a normally-on type, comprising a heterostructure; a dielectric layer extending over the heterostructure; and a gate electrode extending right through the dielectric layer. The gate electrode is a stack, which includes: a protection layer, which is made of a metal nitride with stuffed grain boundaries and extends over the heterostructure, and a first metal layer, which extends over the protection layer and is completely separated from the heterostructure by said protection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.