Patent · US Active

Method of manufacturing a HEMT device with reduced gate leakage current, and HEMT device

US11043574B2 · kind B2 · utility

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21Claims
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Key dates

Filing dateAug 7, 2019
Grant dateJun 22, 2021
Priority date
Expiry dateAug 7, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/256
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An HEMT device of a normally-on type, comprising a heterostructure; a dielectric layer extending over the heterostructure; and a gate electrode extending right through the dielectric layer. The gate electrode is a stack, which includes: a protection layer, which is made of a metal nitride with stuffed grain boundaries and extends over the heterostructure, and a first metal layer, which extends over the protection layer and is completely separated from the heterostructure by said protection layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.