Method for selectively depositing a conductive coating over a patterning coating and device including a conductive coating
US11043636B2 · kind B2 · utility
3Cited by
3References
41Claims
0Family size
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Key dates
| Filing date | May 17, 2018 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | May 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/3026
Abstract
A device includes: (1) a substrate; (2) a patterning coating covering at least a portion of the substrate, the patterning coating including a first region and a second region; and (3) a conductive coating covering the second region of the patterning coating, wherein the first region has a first initial sticking probability for a material of the conductive coating, the second region has a second initial sticking probability for the material of the conductive coating, and the second initial sticking probability is different from the first initial sticking probability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.