Crosslinkable polymeric materials for dielectric layers in electronic devices
US11043643B2 · kind B2 · utility
0Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2016 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Nov 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/68
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Compositions for providing a dielectric layer in an electronic device wherein the composition comprises a polymer which polymer contains one or more building blocks, wherein at least 25 mol % of the total number of building blocks in the polymer are of the general formula having olefinic oligo-dihydrodicyclopentadienyl functionalities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.