Composite earcushion
US11044542B2 · kind B2 · utility
1Cited by
26References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2019 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Nov 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2420/07
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headphone cushion includes a body formed of a partially reticulated polymeric foam and including a front surface configured to engage or surround an ear or head of a user, side surfaces, and a rear surface. The headphone cushion further includes a layer of high-density polymer material extending over at least a portion of the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.