Polyurethane, curable composition, overcoat film, and flexible wiring board and production method therefor
US11044807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2016 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Apr 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1305
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are a polyurethane and a curable composition capable of obtaining an overcoat film for a flexible wiring board that is excellent in low-warpage properties, flexibility, long-term insulation reliability, and wiring disconnection preventing properties. The polyurethane has: a structural unit of formula (1) (in formula (1), an n-number of R1 each independently represents a 1,2-phenylene group or a 1,2-phenylene group having a substituent, an (n+1)-number of R2 each independently represents a hydrocarbon group having 3-9 carbon atoms, and n represents an integer from 1 to 50); a structural unit of formula (2) (in formula (2). R3 represents a divalent organic group having 6-14 carbon atoms); and a structural unit of formula (3) (in formula (3), R3 represents a divalent organic group having 6-14 carbon atoms, and R4 represents a methyl or ethyl group).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.