Formulation of an organic functional material comprising an epoxy group containing solvent
US11046884B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Jul 29, 2016 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Dec 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/351
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to formulations containing at least one organic functional material and at least a first organic solvent, wherein said first organic solvent contains at least one epoxy-group as well as to electronic devices prepared by using these formulations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.