CMC components having microchannels and methods for forming microchannels in CMC components
US11047240B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2017 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Apr 6, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
CMC components having microchannels and methods for forming microchannels in CMC components are provided. For example, a method for forming microchannels in a CMC component comprises laying up a plurality of body plies for forming a body of the CMC component; laying up a microchannel ply on the plurality of body plies that has at least one void therein for forming at least one microchannel; laying up a cover ply on the microchannel ply to define an outer layer of the CMC component; and processing the laid up body plies, microchannel ply, and cover ply to form the CMC component. In another embodiment, the method comprises applying an additive matrix to the body plies to define at least one microchannel. In still other embodiments, the method comprises machining at least one microchannel in the plurality of body plies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.