Shape memory alloy subsurface array deployment mechanism
US11047370B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2020 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | May 27, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10K11/008
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A deployment body for a sensor array includes at least one superelastic spring formed of a shape memory alloy (SMA) material that enables activation of the deployment body. The SMA spring is configured to expand from a stowed position in which the SMA spring is wound around a central hub of the deployment body to a deployed position in which the SMA spring is extended in a radially outward direction relative to the central hub. A stiffness of the SMA spring enables the SMA spring to hold cables of the sensor array and maintain a deployed shape of the sensor array, which may be a volumetric array. Using the SMA material is advantageous in that the material is tuned to maintain superelasticity based on at least one of an intended operating temperature and a desired expansion ratio of stowed to deployed diameter of the deployment body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.