Pressure sensor assembly and method for manufacturing a pressure sensor assembly
US11047753B2 · kind B2 · utility
0Cited by
255References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 22, 2019 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Nov 21, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/148
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor assembly and method for manufacturing a pressure sensor assembly is disclosed and includes a pressure responsive component having a pressure sensitive element and an output signal generator disposed on a common substrate. The substrate has an aperture extending completely there through and the pressure sensitive element is disposed in communication with the aperture. The aperture is open to the ambient environment. The pressure responsive component is received in a connector which is received in a housing. Multiple seal structures isolate the pressure responsive component within the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.